Patent Assignment
Reel/Frame 043143/0473
Assignment of Assignor's Interest
Recorded: 2017-07-31
Pages: 3
Assignors
HO, CHUN-TE
Executed: 2017-07-27
LIANG, MING-CHUNG
Executed: 2017-07-27
CHIU, CHIEN-CHIH
Executed: 2017-07-27
CHEN, CHIEN-HAN
Executed: 2017-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Method