Patent Assignment
Reel/Frame 043146/0300
Assignment of Assignor's Interest
Recorded: 2017-07-31
Pages: 3
Assignors
CHU, WEI-CHEN
Executed: 2017-07-19
LIU, HSIANG-WEI
Executed: 2017-07-19
YANG, TAI-I
Executed: 2017-07-19
WU, CHIA-TIEN
Executed: 2017-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnection Structure of Semiconductor Device