Patent Assignment
Reel/Frame 043151/0184
Assignment of Assignor's Interest
Recorded: 2017-08-01
Pages: 7
Assignors
COLINGE, JEAN-PIERRE
Executed: 2017-06-27
DIAZ, CARLOS H.
Executed: 2017-07-30
GUO, TA-PEN
Executed: 2017-07-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Manufacturing Monolithic Three-Dimensional (3D) Integrated Circuits