Patent Assignment
Reel/Frame 043156/0624
Assignment of Assignor's Interest
Recorded: 2017-08-01
Pages: 7
Assignors
BAI, JIE
Executed: 2014-03-13
DO, LY
Executed: 2014-03-13
CHAU, HUNG
Executed: 2014-03-13
KIM, YOUNSANG
Executed: 2014-03-13
ECKENRODE, JULISSA
Executed: 2014-03-13
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property
(1)
Thermally Conductive Pre-Applied Underfill Formulations and Uses Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.