IP Library › Assignment 043156/0769
Patent Assignment
Reel/Frame 043156/0769

Assignment of Assignor's Interest

Recorded: 2017-08-01 Pages: 3
Assignor
HENKEL CORPORATION
Executed: 2017-04-18
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property (1)
Thermally Conductive Pre-Applied Underfill Formulations and Uses Thereof
Application: 15/229,596 →
Publication: US 2016/0340557
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 1, 2017
From: BAI, JIE; DO, LY; CHAU, HUNG; KIM, YOUNSANG
To: HENKEL CORPORATION
Reel/Frame 043156/0624 →
Assignment of Assignor's Interest Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →