Patent Assignment
Reel/Frame 043156/0988
Assignment of Assignor's Interest
Recorded: 2017-08-01
Pages: 5
Assignors
WANG, YU-SHENG
Executed: 2017-07-18
LIN, YU-TING
Executed: 2017-07-18
HSU, HUNG-CHANG
Executed: 2017-07-18
LIU, HSIAO-PING
Executed: 2017-07-17
LU, HUNG PIN
Executed: 2017-07-18
LIN, YUAN WEN
Executed: 2017-07-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods for Forming Metal Layers in Openings and Apparatus for Forming Same