Patent Assignment
Reel/Frame 043162/0256
Assignment of Assignor's Interest
Recorded: 2017-08-02
Pages: 8
Assignors
HUNG, CHING-WEN
Executed: 2017-07-27
TSAI, SHIH-HUNG
Executed: 2017-07-27
YOUNG, CHORNG-LIH
Executed: 2017-07-27
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method of Fabricating a Semiconductor Device Having Contact Structures
Patent:
10,032,672 →
Application:
15/666,583 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.