IP Library Assignment 043170/0265
Patent Assignment
Reel/Frame 043170/0265

Change of Name

Recorded: 2017-07-12 Pages: 5
Assignor
SANDIA CORPORATION
Executed: 2017-05-01
Assignee
NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC
P.O. BOX 5800, MS-0161, LEGAL TECHNOLOGY TRANSFER CENTER, ALBUQUERQUE, NEW MEXICO, 87185
Covered Property (1)
Wafer Scale Oblique Angle Plasma Etching
Patent: 9,659,797 →
Application: 14/489,362 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 29, 2014
From: BURCKEL, DAVID BRUCE; JARECKI, ROBERT L., JR; FINNEGAN, PATRICK SEAN
To: SANDIA CORPORATION
Reel/Frame 033841/0239 →
Confirmatory License Oct 28, 2014
From: SANDIA CORPORATION
To: U.S. DEPARTMENT OF ENERGY
Reel/Frame 034067/0484 →
Change of Name Aug 21, 2017
From: SANDIA CORPORATION
To: NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC
Reel/Frame 043618/0610 →