Patent Assignment
Reel/Frame 043174/0119
Assignment of Assignor's Interest
Recorded: 2017-08-02
Pages: 2
Assignors
ZOU, QUANBO
Executed: 2013-02-25
AKRAM, SALMAN
Executed: 2013-02-22
BHAT, JEROME CHANDRA
Executed: 2013-02-25
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621 BA, NETHERLANDS
Covered Property
(1)
Method of Bonding a Semiconductor Device to a Support Substrate
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 14, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 043543/0903 →
Assignment of Assignor's Interest
Nov 10, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044792/0018 →
Patent Security Agreement
Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →