Patent Assignment
Reel/Frame 043214/0646
Assignment of Assignor's Interest
Recorded: 2017-08-07
Pages: 4
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding System