Patent Assignment
Reel/Frame 043240/0800
Assignment of Assignor's Interest
Recorded: 2017-08-09
Pages: 4
Assignors
HSU, WEN-SUNG
Executed: 2016-05-06
LIN, SHIH-CHIN
Executed: 2016-05-06
CHENG, TAO
Executed: 2016-05-06
CHANG, ANDREW C.
Executed: 2016-05-06
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Manufacturing Method of Semiconductor Package and Manufacturing Method of Semiconductor Device