Patent Assignment
Reel/Frame 043249/0721
Assignment of Assignor's Interest
Recorded: 2017-08-09
Pages: 2
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO, KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Semiconductor Package with Multiple Molding Routing Layers and a Method of Manufacturing the Same