Patent Assignment
Reel/Frame 043250/0170
Assignment of Assignor's Interest
Recorded: 2017-08-09
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Device and Method of Manufacturing the Same