Patent Assignment
Reel/Frame 043267/0126
Assignment of Assignor's Interest
Recorded: 2017-08-11
Pages: 4
Assignors
KIM, HYUNG DAL
Executed: 2017-06-20
KWON, OH HYUCK
Executed: 2017-06-20
KANG, HAN VIT
Executed: 2017-06-20
KIM, JUN YOUNG
Executed: 2017-06-20
KIM, MOON KYEONG
Executed: 2017-06-20
KIM, SANG SEOB
Executed: 2017-06-20
PARK, JUNG SIK
Executed: 2017-06-20
JUNG, HEE SEOK
Executed: 2017-06-20
CHO, SUNG
Executed: 2017-06-20
SHIN, HEUNG SIK
Executed: 2017-06-20
OH, JI WOONG
Executed: 2017-06-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Mounting Structure for Module in Electronic Device