Patent Assignment
Reel/Frame 043284/0779
Assignment of Assignor's Interest
Recorded: 2017-08-14
Pages: 3
Assignors
SEE, GUAN HUEI
Executed: 2017-07-14
GU, YU
Executed: 2017-07-14
SUNDARRAJAN, ARVIND
Executed: 2017-07-17
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Method and Apparatus for Wafer Level Packaging
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 28, 2017
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD
To: APPLIED MATERIALS, INC.
Reel/Frame 043421/0828 →
Assignment of Assignor's Interest
Nov 16, 2017
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 044154/0022 →