Patent Assignment
Reel/Frame 043287/0726
Assignment of Assignor's Interest
Recorded: 2017-08-14
Pages: 7
Assignors
LYU, LI-HAO
Executed: 2017-08-03
TSAI, CHIEH-JU
Executed: 2017-08-03
LIN, YU-KAI
Executed: 2017-08-03
HSIEH, WEI-MING
Executed: 2017-08-04
TSAI, YU-PIN
Executed: 2017-08-04
TSENG, MAN-WEN
Executed: 2017-08-04
LU, YU-TING
Executed: 2017-08-04
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and a Method of Manufacturing the Same