Patent Assignment
Reel/Frame 043287/0942
Assignment of Assignor's Interest
Recorded: 2017-08-14
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2017-08-01
YU, CHUN-HUI
Executed: 2017-08-01
YEE, KUO-CHUNG
Executed: 2017-08-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Method for Fabricating the Same