Patent Assignment
Reel/Frame 043301/0415
Assignment of Assignor's Interest
Recorded: 2017-08-15
Pages: 6
Assignors
HUANG, LI-HSIEN
Executed: 2017-07-20
WU, CHI-HSI
Executed: 2017-07-24
YU, CHEN-HUA
Executed: 2017-07-24
YEH, DER-CHYANG
Executed: 2017-07-21
TSENG, HUA-WEI
Executed: 2017-07-20
YEW, MING-CHIH
Executed: 2017-07-24
LAI, YI-JEN
Executed: 2017-07-27
YEH, MING-SHIH
Executed: 2017-07-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semicondcutor Package, Package on Package Structure and Method of Froming Package on Package Structure