Patent Assignment
Reel/Frame 043303/0329
Assignment of Assignor's Interest
Recorded: 2017-08-16
Pages: 4
Assignor
SON, JONG-PIL
Executed: 2017-06-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device and a Chip Stack Package Having the Same