Patent Assignment
Reel/Frame 043308/0527
Assignment of Assignor's Interest
Recorded: 2017-08-16
Pages: 4
Assignors
YANG, SHIN-YI
Executed: 2017-08-09
YEH, CHING-FU
Executed: 2017-08-09
LEE, MING-HAN
Executed: 2017-08-09
SHUE, SHAU-LIN
Executed: 2017-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Interconnect Structure Having Graphene-Capped Metal Interconnects