Patent Assignment
Reel/Frame 043309/0962
Assignment of Assignor's Interest
Recorded: 2017-08-16
Pages: 3
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
METHOD OF PRODUCING SiC WAFER