Patent Assignment
Reel/Frame 043321/0425
Assignment of Assignor's Interest
Recorded: 2017-08-17
Pages: 3
Assignors
KUO, TZ-JUN
Executed: 2017-08-11
HO, CHIEN-HSIN
Executed: 2017-08-11
LEE, MING-HAN
Executed: 2017-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure Without Barrier Layer on Bottom Surface of Via