Patent Assignment
Reel/Frame 043335/0725
Assignment of Assignor's Interest
Recorded: 2017-08-18
Pages: 5
Assignors
SEIDEMANN, GEORG
Executed: 2017-07-13
WAIDHAS, BERND
Executed: 2017-07-16
WAGNER, THOMAS
Executed: 2017-07-13
WOLTER, ANDREAS
Executed: 2017-07-13
MILLOU, LAURENT
Executed: 2017-07-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Cross-Connected Multi-Chip Modules Coupled by Silicon Bent-Bridge Interconnects and Methods of Assembling Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name of the Receiving Party Previously Recorded on Reel 043335 Frame 0725. Assignor(S) Hereby Confirms the Assignment.
May 3, 2019
From: SEIDEMANN, GEORG; WAIDHAS, BERND; WAGNER, THOMAS; WOLTER, ANDREAS
To: INTEL IP CORPORATION
Reel/Frame 049080/0399 →
Assignment of Assignor's Interest
May 22, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 056337/0609 →