IP Library › Assignment 043337/0792
Patent Assignment
Reel/Frame 043337/0792

Assignment of Assignor's Interest

Recorded: 2017-08-18 Pages: 4
Assignor
SUNDARAM, ARVIND
Executed: 2017-07-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Embedded Multi-Die Interconnect Bridge
Application: 15/457,102 →
Publication: US 2018/0261545