Patent Assignment
Reel/Frame 043357/0347
Assignment of Assignor's Interest
Recorded: 2017-08-22
Pages: 3
Assignors
LEE, HSIN-YI
Executed: 2016-04-07
TSAI, CHENG-YEN
Executed: 2016-04-07
LEE, DA-YUAN
Executed: 2016-04-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Atomic Layer Deposition Methods and Structures Thereof