Patent Assignment
Reel/Frame 043362/0088
Assignment of Assignor's Interest
Recorded: 2017-08-22
Pages: 5
Assignors
CHEN, CHIEN-HUA
Executed: 2017-05-11
LIN, HUNG-YI
Executed: 2017-05-11
KUNG, CHENG-YUAN
Executed: 2017-05-11
LEE, TECK-CHONG
Executed: 2017-05-11
LIN, SHIUAN-YU
Executed: 2017-05-11
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package Comprising a Dielectric Layer with Built-in Inductor