Patent Assignment
Reel/Frame 043373/0584
Assignment of Assignor's Interest
Recorded: 2017-08-23
Pages: 4
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Bonded Semiconductor Wafer and Method for Manufacturing Bonded Semiconductor Wafer