Patent Assignment
Reel/Frame 043379/0041
Assignment of Assignor's Interest
Recorded: 2017-08-24
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method of Fabricating the Same
Patent:
10,134,685 →
Application:
15/662,274 →