Patent Assignment
Reel/Frame 043390/0279
Assignment of Assignor's Interest
Recorded: 2017-08-24
Pages: 5
Assignors
HA, SEUNG HWA
Executed: 2017-03-08
JO, JUNG YUN
Executed: 2017-03-09
KIM, BYOUNG YONG
Executed: 2017-03-08
YANG, JEONG DO
Executed: 2017-03-08
HWANG, JEONG HO
Executed: 2017-03-08
Assignee
SAMSUNG DISPLAY CO., LTD.
1, SAMSUNG-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17113, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Electronic Device Including the Same, and Method of Connecting the Semiconductor Chip to the Electronic Device