Patent Assignment
Reel/Frame 043403/0534
Assignment of Assignor's Interest
Recorded: 2017-08-25
Pages: 4
Assignor
SIEGEL, JOSEPH
Executed: 2010-08-30
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, PO BOX 3453, KEVIN A. O'NEIL, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property
(1)
Semiconductor Chip with Redundant Thru-Silicon-Vias
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 25, 2016
From: BLACK, BRYAN; SU, MICHAEL Z.; PREJEAN, SETH
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 039542/0415 →
Assignment of Assignor's Interest
Aug 25, 2016
From: SIEGEL, JOSEPH
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 039542/0447 →
Assignment of Assignor's Interest
Aug 25, 2016
From: REFAI-AHMED, GAMAL
To: ATI TECHNOLOGIES ULC
Reel/Frame 039542/0484 →
Assignment of Assignor's Interest
Aug 25, 2017
From: BLACK, BRYAN; SU, MICHAEL Z.; PREJEAN, SETH
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 043403/0572 →
Assignment of Assignor's Interest
Aug 25, 2017
From: REFAI-AHMED, GAMAL
To: ATI TECHNOLOGIES ULC
Reel/Frame 043403/0652 →