Patent Assignment
Reel/Frame 043460/0093
Assignment of Assignor's Interest
Recorded: 2017-08-31
Pages: 9
Assignors
ZHU, HONGBIN
Executed: 2017-08-30
ZIN, QINGLIN
Executed: 2017-08-30
OSTERBERG, DANIEL
Executed: 2017-08-30
CARLSON, MERRI L.
Executed: 2017-08-30
HALLER, GORDON A.
Executed: 2017-08-30
ADAMS, JEREMY
Executed: 2017-08-30
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Devices and Semiconductor Dice Including Electrically Conductive Interconnects Between Die Rings
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 6 to Patent Security Agreement
Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
Supplement No. 6 to Patent Security Agreement
Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →