Patent Assignment
Reel/Frame 043461/0731
Assignment of Assignor's Interest
Recorded: 2017-08-31
Pages: 4
Assignors
YANG, TAI-I
Executed: 2017-08-21
CHU, WEI-CHEN
Executed: 2017-08-21
SU, LI-LIN
Executed: 2017-08-21
YANG, SHIN-YI
Executed: 2017-08-21
CHUANG, CHENG-CHI
Executed: 2017-08-21
CHEN, HSIN-PING
Executed: 2017-08-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Interconnection Structure of Semiconductor Device