Assignment of Assignor's Interest

Recorded: 2017-09-05 Pages: 3

Assignor

UTSUNOMIYA, HIROYUKI

Executed: 2017-08-31

Assignee

SII SEMICONDUCTOR CORPORATION

8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN

Covered Property (1)

Semiconductor Chip, Semiconductor Apparatus, Semiconductor Wafer, and Semiconductor Wafer Dicing Method

Application: 15/695,357 →

Publication: US 2018/0076150

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.