Patent Assignment
Reel/Frame 043492/0918
Assignment of Assignor's Interest
Recorded: 2017-09-06
Pages: 4
Assignors
WU, KAI-CHIANG
Executed: 2017-08-22
YU, CHEN-HUA
Executed: 2017-08-22
YEE, KUO-CHUNG
Executed: 2017-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof