Patent Assignment
Reel/Frame 043510/0193
Assignment of Assignor's Interest
Recorded: 2017-09-06
Pages: 3
Assignee
KANDOU LABS, S.A.
EPFL INNOVATION PARK, BUILDING I, LAUSANNE, 1015, SWITZERLAND
Covered Property
(1)
Method and Apparatus for High Speed Chip-to-Chip Communications