Patent Assignment
Reel/Frame 043527/0378
Assignment of Assignor's Interest
Recorded: 2017-09-07
Pages: 5
Assignors
CHEN, BO-SYUN
Executed: 2017-09-06
CHEN, TANG-YUAN
Executed: 2017-09-06
CHEN, YU-CHANG
Executed: 2017-09-07
YANG, JIN-FENG
Executed: 2017-09-07
KAO, CHIN-LI
Executed: 2017-09-06
SHIH, MENG-KAI
Executed: 2017-09-06
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same