Patent Assignment
Reel/Frame 043540/0312
Assignment of Assignor's Interest
Recorded: 2017-09-10
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Integrated Circuit Component Package and Method of Fabricating the Same