Patent Assignment
Reel/Frame 043549/0954
Assignment of Assignor's Interest
Recorded: 2017-08-14
Pages: 6
Assignors
KWAK, BYOUNG SOO
Executed: 2016-07-29
MIN, TAE HONG
Executed: 2016-07-29
LEE, IN YOUNG
Executed: 2016-07-29
CHO, TAE JE
Executed: 2016-07-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Multiple Semiconductor Chips