Patent Assignment
Reel/Frame 043575/0925
Assignment of Assignor's Interest
Recorded: 2017-09-13
Pages: 3
Assignors
CHO, JUN-HYUN
Executed: 2017-09-06
RYU, YOUNG-SUK
Executed: 2017-09-06
AN, JAE-YONG
Executed: 2017-09-06
CHO, IL-HWAN
Executed: 2017-09-06
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Bump