Patent Assignment
Reel/Frame 043598/0128
Assignment of Assignor's Interest
Recorded: 2017-09-14
Pages: 12
Assignors
WANG, MINGZHU
Executed: 2017-08-24
ZHAO, BOJIE
Executed: 2017-08-23
TANAKA, TAKEHIKO
Executed: 2017-08-24
GUO, NAN
Executed: 2017-08-24
CHEN, ZHENYU
Executed: 2017-08-23
JIANG, HENG
Executed: 2017-08-25
LUAN, ZHONGYU
Executed: 2017-08-24
XI, FENGSHENG
Executed: 2017-08-24
CHEN, FEIFAN
Executed: 2017-08-23
DING, LIANG
Executed: 2017-08-23
Assignee
NINGBO SUNNY OPOTECH CO., LTD.
66-68, SHUNYU ROAD, YUYAO CITY,, NINGBO, ZHEJIANG, 315400, CHINA
Covered Property
(1)
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device