Patent Assignment
Reel/Frame 043599/0745
Assignment of Assignor's Interest
Recorded: 2017-09-15
Pages: 11
Assignors
TESSARIOL, PAOLO
Executed: 2017-09-13
DORHOUT, JUSTIN B.
Executed: 2017-09-14
CHARY, INDRA V.
Executed: 2017-09-14
FANG, JUN
Executed: 2017-09-14
PARK, MATTHEW
Executed: 2017-09-14
XIE, ZHIQIANG
Executed: 2017-09-14
STULL, SCOTT D.
Executed: 2017-09-14
OSTERBERG, DANIEL
Executed: 2017-09-14
REECE, JASON
Executed: 2017-09-14
LEE, JIAN
Executed: 2017-09-14
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property
(1)
Device, A Method Used In Forming A Circuit Structure, A Method Used In Forming An Array Of Elevationally-Extending Transistors And A Circuit Structure Adjacent Thereto
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 6 to Patent Security Agreement
Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
Supplement No. 6 to Patent Security Agreement
Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →