Patent Assignment
Reel/Frame 043606/0428
Assignment of Assignor's Interest
Recorded: 2017-09-15
Pages: 3
Assignor
UMEDA, DAISUKE
Executed: 2017-04-18
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device