Patent Assignment
Reel/Frame 043610/0071
Assignment of Assignor's Interest
Recorded: 2017-09-18
Pages: 3
Assignors
LIN, YU-MIN
Executed: 2017-07-10
KAO, KUO-SHU
Executed: 2017-07-10
CHANG, JING-YAO
Executed: 2017-07-10
CHANG, TAO-CHIH
Executed: 2017-07-10
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Chip Packaging and Composite System Board