Patent Assignment
Reel/Frame 043625/0475
Assignment of Assignor's Interest
Recorded: 2017-09-19
Pages: 2
Assignors
BIH, SHIH WEI
Executed: 2017-08-30
LIN, CHUN-CHIH
Executed: 2017-08-30
CHEN, YEN-YU
Executed: 2017-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Fabricating Semiconductor Device with Adhesion Layer