Patent Assignment
Reel/Frame 043628/0719
Assignment of Assignor's Interest
Recorded: 2017-09-19
Pages: 6
Assignors
HASEGAWA, TOSHIAKI
Executed: 2017-07-28
AOYAGI, KENICHI
Executed: 2017-07-28
HAGIMOTO, YOSHIYA
Executed: 2017-07-31
FUJII, NOBUTOSHI
Executed: 2017-08-01
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Electronic Component, Electronic Component Mounting Substrate, and Electronic Component Mounting Method to Facilitate Positional Alignment Between the Electronic Component and the Mounting Substrate