Patent Assignment
Reel/Frame 043630/0531
Assignment of Assignor's Interest
Recorded: 2017-09-19
Pages: 5
Assignors
HA, YOUNG JIN
Executed: 2017-09-13
JUNG, HYUN JU
Executed: 2017-09-13
IM, JEONG HWAN
Executed: 2017-09-13
JUN, SO YOUNG
Executed: 2017-09-13
PARK, SUNG JIN
Executed: 2017-09-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Bead