Patent Assignment
Reel/Frame 043644/0744
Assignment of Assignor's Interest
Recorded: 2017-09-21
Pages: 5
Assignors
YU, CHEN-HUA
Executed: 2017-09-05
WANG, CHUEI-TANG
Executed: 2017-09-05
TANG, TZU-CHUN
Executed: 2017-09-05
CHEN, WEI-TING
Executed: 2017-09-05
CHEN, CHIEH-YEN
Executed: 2017-09-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same