Patent Assignment
Reel/Frame 043658/0308
Assignment of Assignor's Interest
Recorded: 2017-09-21
Pages: 8
Assignors
CHEN, LI-HAN
Executed: 2017-09-18
CHIU, CHUN-CHIEH
Executed: 2017-09-18
TSAI, WEI-CHUAN
Executed: 2017-09-18
YI, YEN-TSAI
Executed: 2017-09-18
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Manufacturing Method of Interconnect Structure