Patent Assignment
Reel/Frame 043684/0367
Assignment of Assignor's Interest
Recorded: 2017-09-25
Pages: 3
Assignor
HIRATA, KAZUYA
Executed: 2017-08-29
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
SiC WAFER PRODUCING METHOD