Patent Assignment
Reel/Frame 043712/0345
Assignment of Assignor's Interest
Recorded: 2017-09-27
Pages: 7
Assignors
SIM, SUNG HYUN
Executed: 2017-08-31
YOO, HANUL
Executed: 2017-08-31
KIM, YONG IL
Executed: 2017-08-30
NOH, HYE SEOK
Executed: 2017-08-31
YEON, JI HYE
Executed: 2017-09-05
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Light Emitting Device Package